High Speed Chip Packing Machine

The invention relates to the field of chip processing, in particular to a turret chip taping machine.

Background technology:

The traditional solid crystal machine equipment adopts the structure of single swing arm and single suction nozzle. Due to the limitation of the mechanical structure of the equipment and its operation accuracy, it is impossible to transfer the picked chip to tape packaging; However, due to the limitation of mechanical structure and manufacturing process, the conventional taping machine can not grasp the chip products. With the development of semiconductor chip (LED) and the strong support of the state for the semiconductor industry, the market demand for semiconductor chip (LED) packaging equipment is increasing. At the same time, the appearance of chip (LED) is becoming more and more miniaturized or ultra miniaturized, which gives birth to some products for tape packaging of chips, which require high speed, high precision High reliability. Some enterprises produce by manual transfer, which has lower accuracy and efficiency, brings difficulties to the next packaging process and affects the packaging quality. It can only be applied to some equipment with low precision and speed requirements, but it can not meet the manufacturing requirements of chip packaging products with high speed, high precision and high reliability; However, the high price of imported equipment and large initial investment in small and medium-sized enterprises seriously restrict the development of small and medium-sized enterprises.

Technical realization elements:

According to the shortcomings of the above prior art, the technical problem to be solved by the invention is to propose a turret chip tape braiding machine, which adopts a multi swing arm and multi suction nozzle structure and is combined with DDR series direct drive motor, which can continuously and accurately take crystals from the crystal disc of the blue film, and accurately place the carrier tape for tape braiding and packaging, High speed chip placement for high-speed chip space transfer greatly saves manpower.

The utility model relates to a turret chip taping machine, which comprises a loading and unloading system, a correction and compensation system, a taking and placing system, a taping sealing system and a detection system;

Wherein, the loading and unloading system is used to transport the crystal disc loaded with the chip to the specified position, and reset the empty crystal disc to load the chip;

The correction compensation system is used to grasp the crystal disc and fine tune the position of the crystal disc;

The taking and placing system is used for picking up and transporting the chip on the crystal disc and transferring the chip position;

The tape binding and sealing system receives the chip transported from the taking and placing system for tape binding and packaging;

The detection system is used to screen the good and bad products in the chip and eliminate the bad chip.

Optionally, the loading and unloading system comprises a crystal disc basket lifting device, the crystal disc basket lifting device comprises a crystal disc basket, a support platform, a tensioning device, a lifting base and a lifting driving device, the lifting base is provided with the lifting driving device, and the lifting driving device comprises a first driving motor, a first synchronous belt and a transmission screw rod, The output shaft of the first drive motor is driven and connected with a first driving wheel, the first driving wheel is driven and connected with the first driven wheel through the first synchronous belt, the first driven wheel is fixedly connected with the transmission screw rod, the transmission screw rod is threaded with a transmission screw rod nut, the transmission screw rod nut is fixedly connected with a sliding plate, and the sliding plate is fixedly connected with the support platform, The crystal disc basket is arranged on the upper end face of the support carrier, and one end of the support carrier is provided with the tensioning device.

Optionally, the correction and compensation system comprises a wafer compensation device, a self-correction thimble device and a wafer disc grasping and handling device, wherein;

The wafer compensation device comprises an X-axis motion module, a Y-axis motion module and θ The x-axis motion module drives the y-axis motion module to move in the x-axis direction, and the y-axis motion module drives the θ The axis motion module is displaced in the z-axis direction, θ The axis motion module includes θ A shaft support carrier, a fourth drive motor, a belt pulley group, a mother carrier ring of a wafer disk, a carrier ring tray, a carrier ring of a wafer disk, a carrier ring guide device, a carrier ring guide wheel device and a carrier ring pressing device θ The crystal disc sub carrier ring is arranged on the shaft support carrier, θ The shaft support platform is also provided with the fourth drive motor, and the output shaft of the fourth drive motor runs through the shaft θ The shaft supports the carrier and drives and connects the belt pulley group. The belt pulley group is used for adjustment. The crystal disc mother carrier ring is matched with the wafer disc carrier ring and sleeved at the outer end of the wafer disc carrier ring. The carrier ring tray is also arranged between the crystal disc mother carrier ring and the wafer disc carrier ring. The carrier ring guide device and the carrier ring guide wheel device guide the installation position of the crystal disc mother carrier ring, The carrier ring pressing device is used for relatively fixing the positions of the mother carrier ring of the wafer disk, the carrier ring tray and the carrier ring of the wafer disk;

The self-tuning thimble device comprises an X-axis self-tuning module, a Y-axis self-tuning module, a Z-axis self-tuning module and a thimble movement module. The x-axis self-tuning module drives the y-axis self-tuning module to move in the x-axis direction, and the y-axis self-tuning module drives the z-axis self-tuning module to move in the y-axis direction, The z-axis self-tuning module drives the thimble motion module to move in the z-axis direction. The thimble motion module includes an eighth drive motor, an eighth eccentric transmission mechanism, a thimble and a thimble anti-collision device. The output shaft of the eighth drive motor is connected with the eighth eccentric transmission mechanism, and the eighth eccentric transmission mechanism drives the thimble to move back and forth in the z-axis direction, The thimble anti-collision device is arranged at the thimble;

The crystal disc grasping and handling device comprises a ninth drive motor, a handling screw rod, a transmission support plate, a pneumatic lifting device and a claw. The output shaft of the ninth drive motor is connected with the handling screw rod through transmission, the handling screw rod nut is connected with the thread on the handling screw rod, and the handling screw rod nut is fixedly connected with the transmission support plate, The lower end of the transmission support plate is provided with the pneumatic lifting device, and the output shaft of the pneumatic lifting device is connected with the claw.

Optionally, the taking and placing system comprises a turret taking and placing system, the turret taking and placing system comprises a swing arm driving motor, a chip taking and placing swing arm group, a suction nozzle, a swing arm linear guide device, a Z-axis wafer pressing device, a Z-axis braiding pressing device and a vacuum distribution device, and the output shaft of the swing arm driving motor is connected with the chip taking and placing swing arm group, The chip taking and placing swing arm group comprises a plurality of swing arms distributed circumferentially, the front end of each swing arm is provided with the suction nozzle, the vacuum distribution device is connected with the suction nozzle and provides adsorption force for the suction nozzle, and each swing arm is also provided with a swing arm linear guide device, The z-axis wafer pressing device and the z-axis braiding pressing device are symmetrically arranged at both ends of the swing arm driving motor.

Optionally, the swing arm drive motor is DDR series direct drive motor.

Optionally, the braiding sealing system comprises a chip braiding sealing device, including a braiding transmission device, a cover belt transmission device, a sealing device and a finished product closing device. The braiding transmission device comprises a braiding transmission motor, a transmission roller and a braiding, the braiding transmission motor drives the transmission roller to rotate through the braiding transmission synchronous belt, and the braiding drives the braiding transmission, The cover belt transmission device comprises a cover belt disc, a rocker release mechanism, a cover belt tensioning device and a cover belt, the cover belt is wound on the cover belt disc, the rocker release mechanism is used to release the cover belt from the cover belt disc, and the cover belt tensioning device is used to adjust the tightness of the cover belt so that the cover belt contacts the braid transplanted with the chip, The sealing device is a heating sealing device for packaging braided tape, cover tape and chip. The finished product closing device comprises a finished product disc. One end of the braided tape is driven on the transmission roller and the other end is gradually wound on the finished product disc.

Optionally, the braiding sealing system also includes a braiding inlet, a tape alarm device and a tape carrying cleaning mechanism. The braiding inlet is used to supply the braiding, the tape alarm device is a photoelectric sensor, which is used to alarm when the braiding cassette is detected, and the tape carrying cleaning mechanism is used to clean the packaged chip.

Optionally, the detection system includes a wafer video detection device, a tape video detection device and a bottom video detection device. The core components of the wafer video detection device, the tape video detection device and the bottom video detection device are industrial CCD cameras.

Optionally, the wafer video detection device and the tape braiding video detection device are electrically connected with the z-axis wafer pressing device and the z-axis tape braiding pressing device respectively, and control the z-axis wafer pressing device and the z-axis tape braiding pressing device respectively.

Optionally, a discard recycling box and a defective product recycling box are also arranged at intervals below the swing arm linear guide device.

The invention has the advantages that the turret chip taping machine with multi swing arm and multi suction nozzle structure and combined with DDR series direct drive motor can continuously and accurately take crystals from the crystal disc of blue film, accurately place the carrier tape for tape packaging, realize the high-speed chip placement of high-speed space transfer, and realize the processes of continuous crystal taking, detection, tape packaging, etc. from the crystal disc, It can meet the production and packaging process requirements of semiconductor chip products with high speed, high precision and high reliability. At the same time, the equipment has the function of automatic loading and unloading of wafer basket, realizing the function of automatic wafer supply and automatic recovery, greatly saving manpower and improving production efficiency; In addition, in terms of equipment cost, the production and manufacturing cost is relatively low compared with foreign equipment, which can be applicable to the capital bearing range of small and medium-sized manufacturing enterprises, and is conducive to the development and production expansion needs of small and medium-sized enterprises.

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